| Layer & Construction | Max Layers | 1-32 layers | HDI up to 22 layers |
| Board Thickness | 0.2mm – 5.0mm | ±10% tolerance |
| Core Thickness | 0.05mm – 3.0mm | Multiple prepreg combinations |
| Copper Weight (Inner/Outer) | 0.5-12 oz (17-420μm) | Plating build-up available |
| Material Types | FR-4, Rogers, Polyimide, Aluminum, Halogen-free | UL94-V0 flame rating |
| Imaging & Etching | Min Trace/Space (Inner) | 2.5/2.5 mil (63μm) | LDI technology |
| Min Trace/Space (Outer) | 3/3 mil (75μm) | Supported by SAP |
| Etching Tolerance | ±0.5 mil (±12.5μm) | Automated optical monitoring |
| Drilling & Vias | Mechanical Drills | 0.15mm – 6.50mm | ±0.05mm positional tolerance |
| Laser Microvias | 0.075mm – 0.15mm | CO₂ & UV laser systems |
| Aspect Ratio (Through-hole) | 15:1 | – |
| Aspect Ratio (Microvias) | 0.75:1 | – |
| Via Types | Blind, Buried, Stacked, Filled | Conductive/non-conductive fill |
| Surface Finish | ENIG | Ni: 3-5μm, Au: 0.05-0.1μm | ≥5 solder cycles |
| Immersion Tin/Ag | 0.1-0.5μm | 12-month shelf life |
| OSP/HASL/ENEPIG | Standard & Lead-free options | RoHS compliant |
| Solder Mask | Registration | ±1.5 mil (±38μm) | LPI & Liquid Ink |
| Colors | Green, Black, Blue, Red, White, Yellow | Matte/Gloss options |
| Min Opening | 2.5 mil (63μm) | Dam & bridge control |
| Testing & Quality | Electrical Test | Flying Probe & Fixture | 100% net coverage |
| Impedance Control | ±7% tolerance | Simulation with TDR |
| Certifications | ISO 9001, IATF 16949, UL, RoHS | Full traceability |
| Special Processes | Edge Plating | Depth ≤20mm | Wrap-around design |
| Gold Fingers | Hard Au: 0.5-1.27μm | 15μ” Ni undercoat |
| Via-in-Pad | Cap & Fill options | Laser direct structuring |
| Thermal Management | Embedded copper coins |
