PCB Assembly

1. Rapid Prototyping Assembly

Accelerated Development Cycles

CapabilitySpecificationIndustry Comparison
Component Size01005 (0.4×0.2mm)Standard: 0201
Fine Pitch0.3mm BGAStandard: 0.5mm
Turnaround24-48 hoursStandard: 5-7 days
First-Pass Yield99.2%Industry: 95%

Key Features:

  • Real-time 3D SPI solder paste inspection
  • Free DFM analysis with 4-hour response
  • Functional test report with every prototype

2.High-Volume Production

Quality Parameter FlashPCBA Standard Industry Benchmark
AOI Rejection Rate <0.05% 0.2-0.5%
ICT Failure Rate 0.02% 0.1-0.3%
DPPM (Defects Per Million) <50 200-500
Traceability Component-level Batch-level

Manufacturing Infrastructure:

  • 12 Yamaha high-speed SMT lines (98,000 CPH)

  • Automated optical inspection (10μm resolution)

  • X-ray inspection for BGA/QFN components

  • In-circuit and functional testing stations

3. Advanced Assembly Technologies

Specialized Processes for Complex Requirements

Complex Assembly Capabilities

Technology Application Equipment
Mixed Technology Through-hole + SMT Selective soldering
Press-Fit Connectors Automotive/Aerospace Hydraulic press systems
Underfill & Epoxy BGA/CSP components Automated dispensing
Conformal Coating Harsh environments Robotic spraying
Box Build Assembly Complete systems Integration workstations

Material Expertise:

  • Lead-free soldering (SAC305)

  • Low-temperature solders (SnBiAg)

  • MIL-spec conformal coatings (UL746E)

  • Thermally conductive adhesives

4. Testing & Validation Services

Comprehensive Quality Assurance

Testing Coverage Analysis

Test TypeCoverageStandards
Automated Optical (AOI)100% boardsIPC-A-610
X-Ray InspectionBGA/QFN componentsIPC-7095
In-Circuit Test (ICT)95% net coverageIEEE 1149.1
Functional Test (FCT)System validationCustomer specs
Environmental StressTemp/Humidity/VibrationMIL-STD-883

5. Industry-Specific Solutions

Tailored Manufacturing for Critical Applications

Industry Key Requirements FlashPCBA Expertise Certifications
Automotive AEC-Q200 components
Extended temp range
Vibration resistance
-12-layer ECU boards
Heavy copper PCBs
Conformal coating
IATF 16949
IPC-6012DA
Medical Biocompatible materials
Class III reliability
Hermetic sealing
-Flex-rigid assemblies
Micro-component placement
Cleanroom assembly
ISO 13485
FDA GMP
Aerospace MIL-spec soldering
High-reliability
Extended lifecycle
-Hi-rel components
PTFE RF boards
Conformal shielding
AS9100D
Nadcap
Industrial IoT Wide temp range
Power management
Wireless connectivity
-Embedded systems
Power management
RF design
UL 508A
CE/EMC

6. Supply Chain Management

End-to-End Component Solutions

Service Capability Benefit
Component Sourcing 500+ certified suppliers Cost optimization
Lifecycle Management EOL/Obsolescence monitoring Risk mitigation
Counterfeit Prevention XRF/X-ray verification Quality assurance
Consignment/VMI Dedicated storage areas Inventory reduction
Supply Chain Resilience Multi-region sourcing Continuity assurance

7. Quality Certifications

Commitment to Excellence

Compliance Standards:

  • IPC-A-610 Class 3 Workmanship

  • IPC-J-STD-001 Soldering

  • ANSI/ESD S20.20 ESD Control

  • RoHS 3 / REACH Compliance

  • UL Recognition (File E522398)

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